Analysis of Volatiles from Printed Circuit Boards
Applications | | CDS AnalyticalInstrumentation
Volatile organic compounds released from printed circuit boards (PCBs) can impact product quality, workplace safety and environmental compliance. Monitoring these emissions is critical in electronics manufacturing for quality control, failure analysis and regulatory adherence.
This application note evaluates headspace thermal desorption using the CDS Model 6500 Autosampler to analyze volatiles directly from intact PCBs. Two scenarios were compared: an unpopulated board and a board populated with soldered components, to identify and compare the emitted compounds.
Instrumentation:
Methodology:
Both the unpopulated and populated boards emitted toluene, benzaldehyde and dichlorobenzene. The populated board showed additional peaks for acetone, tetrachloroethylene and xylenes, reflecting residues from solder flux and component materials. The thermal desorption approach enabled clear separation and sensitive detection of these compounds.
Improvements in trap sorbent materials and coupling with high-resolution mass spectrometry may lower detection limits and expand analyte scope. Integration into in-line production monitoring and high-throughput screening platforms is anticipated. Method adaptation for additional electronic substrates and conformal coatings will broaden application areas.
Headspace thermal desorption using the CDS Model 6500 provides an efficient, sensitive and automated solution for characterizing volatile emissions from PCBs. This method enhances quality control, environmental compliance and failure analysis capabilities in electronics manufacturing.
GC/MSD, Thermal desorption, GC/SQ
IndustriesMaterials Testing
ManufacturerAgilent Technologies, CDS Analytical
Summary
Importance of the Topic
Volatile organic compounds released from printed circuit boards (PCBs) can impact product quality, workplace safety and environmental compliance. Monitoring these emissions is critical in electronics manufacturing for quality control, failure analysis and regulatory adherence.
Study Objectives and Overview
This application note evaluates headspace thermal desorption using the CDS Model 6500 Autosampler to analyze volatiles directly from intact PCBs. Two scenarios were compared: an unpopulated board and a board populated with soldered components, to identify and compare the emitted compounds.
Instrumentation and Methodology
Instrumentation:
- CDS Model 6500 Thermal Desorption Autosampler with a 95 mm × 110 mm sample chamber
- Hewlett-Packard 6890 gas chromatograph with mass selective detector
- 30 m × 0.25 mm HP-5 column; helium carrier gas; 40:1 split ratio
Methodology:
- Equilibration: sample heated to 100 °C and purged with 50 mL/min helium for 20 min
- Trapping: volatiles collected on a thermal desorption trap
- Desorption: backflushed at 300 °C into the GC-MS
- GC oven program: 40 °C (2 min), ramped at 6 °C/min to 290 °C, held for 10 min
Main Results and Discussion
Both the unpopulated and populated boards emitted toluene, benzaldehyde and dichlorobenzene. The populated board showed additional peaks for acetone, tetrachloroethylene and xylenes, reflecting residues from solder flux and component materials. The thermal desorption approach enabled clear separation and sensitive detection of these compounds.
Benefits and Practical Applications
- Non-destructive sampling of intact PCBs
- High sensitivity and reproducibility for trace volatiles
- Automation suitable for routine quality assurance
- Direct evaluation of manufacturing residues and material off-gassing
Future Trends and Potential Applications
Improvements in trap sorbent materials and coupling with high-resolution mass spectrometry may lower detection limits and expand analyte scope. Integration into in-line production monitoring and high-throughput screening platforms is anticipated. Method adaptation for additional electronic substrates and conformal coatings will broaden application areas.
Conclusion
Headspace thermal desorption using the CDS Model 6500 provides an efficient, sensitive and automated solution for characterizing volatile emissions from PCBs. This method enhances quality control, environmental compliance and failure analysis capabilities in electronics manufacturing.
References
- Wampler TP. Thermal Desorption for GC Sample Preparation. LC-GC. 1998;16(3):812.
- Wampler TP. Analysis of Food Volatiles using Headspace-GC Techniques. In: Marsili R, editor. Techniques for Analyzing Food Aroma. Marcel Dekker; 1997.
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